SG560-40 4.0 W/m·K thermal grease (thermal paste) are renowned for its exceptional low thermal impedance and excellent wet-out performance, effectively filling microscopic pits between heat sinks and heat-generating chips. With a minimum interface thickness as low as 0.05 mm, it achieves extremely low thermal impedance, efficiently transferring heat from the heat-generating module. The grease maintains stable form and performance even at high temperatures of up to 150℃. It can be applied manually or through screen printing.