With the acceleration of the evolution of intelligent driving from L2 to L4, the soaring computing power and power consumption (TDP) of chips have put forward higher requirements for heat dissipation solutions. Traditional thermal conductive gel (5W~9W/mK) has been difficult to meet the needs of L3 chips, and the new generation of longitudinal graphene thermal pads innovatively launched by HFC has become the optimal solution for intelligent driving heat dissipation with high rebound, ultra-low thermal resistance and excellent reliability.
From April 15th to 17th, HFC will bring a new generation of graphene thermal pads to the Shanghai New International Expo Center, and sincerely invite industry partners to visit and exchange and witness the innovation of heat dissipation technology!
01 Ultra-high thermal conductivity
The theoretical thermal conductivity of single-layer graphene can reach 5300 W/mK, and the thermal resistance is as low as 0.04°Ccm²/W after the orientation process. Quickly export chip heat.
02 Extreme space adaptability
Through the ultra-thin process, it can be used with a maximum of 70% compression, and the BLT in the chip heat dissipation TIM scenario can reach 0.1mm, which perfectly fits the chip package gap.
03 Absorbs warping stresses
The poroelastic structure adapts to the interface deformation to solve the CTE (coefficient of thermal expansion) mismatch of large-size chips and prevent the material from being extruded. Perfectly absorbs warpage displacements and ensures long-term reliability.