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Exhibition Review | The 25th China International Optoelectronic Expo Ends Successfully, Honfusen Looks Forward to Meeting You Next Time!

2025.09.28

Exhibition Overview With the 25th China International Optoelectronic Expo (CIOE 2024) ended successfully in Shenzhen. With 21 years of experience in t

Industry-innovating heat dissipation technology! Graphene thermal pads solve the problem of heat dissipation of high-power and large-size chips

2025.09.28

01   The “Heating and Warpage Crisis” of High-Power Chips With large models such as DeepSeek opening the door to the application of A

The grand event of the HFC guang Expo on the first day丨Empowering the future of optical communication with heat management innovation.

2025.09.28

On-site coverage: Crowds are surging On September 10th, the 26th China International Optoelectronic Exposition (CIOE2025) grandly opened at the Shenzh

Computing power soars, graphene thermal conductive gaskets efficiently “reduce fever” for data centers!

2025.09.28

With the application of information technologies such as cloud computing, big data, Internet of Things, and digital transformation, the global data ce

Directly hit the HFC booth丨Innovative products attracted the attention of the industry, and the crowd witnessed the hard-core product power

2025.09.28

On April 15th, Shanghai New International Expo Center continued to bloom with innovative potential! On the first day of the exhibition, in front of HF

Sheen Electronic Technology Co., Ltd.

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