◆ Good thermal conductivity, available in options ranging from 2.0 to 8.0 W/m·K.
◆ Soft and elastic after curing, maintaining the required thickness and providing shock absorption.
◆ High electrical insulation, with dielectric strength up to 8 kV/mm.
◆ Excellent flame resistance, achieving a UL94 V-0 rating.
◆ Curing time adjustable based on temperature.
◆ Two-component structure for easy storage.
◆ Can be precisely controlled for thickness and shape using automated equipment.
◆ Complies with RoHS, Halogen-Free, and REACH environmental and safety standards.
【Applications】
◆ CPUs and GPUs
◆ Power Supply Units (PSUs)
◆ LED Modules
◆ Engine Control Units (ECUs)
◆ Gaming Consoles and Laptops
Properties
| Properties | Unit | SE300AB | Test Method |
|---|---|---|---|
| Thermal Conductivity | W/m·K | 3.0 | ASTM D5470 |
| Flow Rate(@50cc,90psi) | g/min | 20±5 | – |
| Color Before Curing | – | Part A: White Part B: Pink |
Visual |
| Density | g/cc | 3.0 | Helium Pycnometry |
| Mix Ratio | – | 1:1 | – |
| Color After Curing | – | Pink | Visual |
| Hardness After Curing | Shore 00 | 55±10 | ASTM D2240 |
| Tack-Free Time (@25℃) | min | 30 | – |
| Full Cure Time (@25℃) | h | 1 | – |
| Full Cure Time (@100℃) | min | 5 | – |
| Minimum Interface Thickness | mm | 0.10 | – |
| Shelf Life (@25℃) | months | 6 | – |
| Operating Temp. | ℃ | -50 ~ 150 | – |
| Dielectric Strength (@AC) | kV/mm | > 8 | ASTM D149 |
| Dielectric Constant (@1MHz) | – | 6.5 | ASTM D150 |
| Volume Resistivity | Ω·cm | >1013 | ASTM D257 |
| Coefficient of Thermal Expansion | ppm/K | 175 | ASTM E831 |
| Flame Rating | – | V-0 | UL94 |
| RoHS | – | PASS | IEC 62321 |
| Halogen | – | PASS | EN 14582 |
| REACH | – | PASS | EN 14372 |
【Storage & Transportation】
Store in a well-ventilated, cool, and dry place, away from open flames.
This product is non-toxic and should be stored and transported as a non-hazardous material.
【Packaging】
● 50cc ● 400cc
【Shelf Life】
6 months



